Posted by Sid982 in Rumors, Xbox 360 | 0 comments

Xbox 360 Jasper Units

Apparently Microsoft snuck a new version of the Xbox 360 Arcade. The new Xbox 360 Jasper was first discovered in a Japanese Xbox 360 Arcade this past April. The new Jasper motherboard is essentially the same as the old Xbox 360 Arcade’s motherboard. The only difference between the motherboards is instead of the 256MB of internal storage the Jasper motherboard can hold up to 512MB of internal storage. Although the one pictured above is Japanese some members of the Xbox Scene forums claim to have a Jasper motherboard meaning they also might be available in North America. All of the discovered Jasper motherboards had one thing in common which was they were all manufactured in April 2009.

Thanks to www.joystiq.com.

Posted by Keenan "SuperMario290" in Xbox 360 | 0 comments

NXE Countering Jasper’s Benefits?

As you may know, Jasper is now coming out with 65nm die, while older systems had a 90nm die, appears to be fixing all of those Red Ring of Death woes. It has also been released that the new Jasper systems have a 150-watt power supply, and a smaller graphics chip, so the system won’t heat up as much, which will lead to less system failures.

This all sounds really freaking great huh? All of your old 360 problems solved, everything’s all good right?

One user on the Official XBox forums had this to say after he bricked his first 360 and rented a new one:

“Guess what? No RRoD but now the DVD drive isn’t working on that. I’m starting to get the feeling that [NXE] wasn’t tested enough with all of the different types of 360 hardware out there. A lot of the components used are different depending on when the console was manufactured.”

So, it’s still unconfirmed whether the new chipset in the Jasper actually relieves these glitches,  but we can all hope so.

Link

Posted by Keenan "SuperMario290" in Xbox 360 | 0 comments

New Xbox 360 model may be Red Ring killer

With the new “Jasper” model of the Xbox 360 out, there’s a new chipset, which is supposed to be better in every single way than the old one. So that would mean that any Xbox 360 made after October 23, 2008 should have the chipset.

There are also many other changes in the new version of the 360. There’s graphics chip, that’s now 65nm, which means that it won’t run as hot as previous Xbox’s, so hopefully no overheating issues and power consumption will be less of a problem. This should fit quiet nicely into the motherboard socket, which means less system failures all together. Also since it’s smaller in size, it’s less expensive to produce which explains why Microsoft has been dropping prices like no other.

The main failure cause [with the older 90-nanometer graphics chips and the boards that came with them] was “thermal fatigue” of the leaded C4 connections between the graphics chip die and its organic carrier. The underfill had too low a glass-transition temperature for the amount of heat generated. That caused cracking over time, resulting in graphics chips coming loose.

In previous versions, Microsoft addressed this with better heat sinks. The temperature sense diode was off in a corner and didn’t reflect the true temperature in the core regions. Jasper has shifted to a material with a significantly higher transition temperature. Coming up with this fix took time, since the new material had to be identified and tested. The smaller 65nm chip die also helps since the stresses that cause the thermal fatigue are related to size.

Does this mean that the red ring of death will be no more forever?

Link